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8.5W/mK Silicone Thermal Pad for GPU CPU LED -40~200℃

8.5W/mK Silicone Thermal Pad for GPU CPU LED -40~200℃

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL & RoHS
Số mô hình: TIF700
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000pcs
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: 24*13*12cm thùng
Thời gian giao hàng: 3-5 ngày làm việc
Điều khoản thanh toán: T/t
Khả năng cung cấp: 1000000 PC/tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: Nhiệt độ cao 8,5W tùy chỉnh khoảng cách silicon silicon plon Ứng dụng: GPU CPU dẫn đầu
Độ dày: 0,04 ~ 0,12inch / 1.0 ~ 3.0mm Trọng lượng riêng: 3,5g/cc
Điện áp phân hủy điện môi: > 5000 VAC Độ dẫn nhiệt: 8,5W/mk
Màu sắc: Xám Hoạt động temp: -40 ~ 200
Từ khóa: Miếng đệm nhiệt silicon
Làm nổi bật:

8.5W/mK silicone thermal pad

,

GPU CPU thermal pad with warranty

,

high-performance thermal pad for LED

High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Product introduction

 

TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features


> Excellent thermal conductivity: 8.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

> Easy release construction
> Electrically isolating

 

Applications


> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of  TIF®700RES Series
Property Value Test method
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer ***
Thickness range 0.04~0.12inch / 1.0~3.0mm ASTM D374
Hardness 10 Shore 00 ASTM 2240
Specific Gravity 3.5 g/cc ASTM D792
Continuos Use Temp -40 to 200℃ Ziitek Test Method
Dielectric Breakdown Voltage ≥5000 VAC ASTM D149
Dielectric Constant 6.7 MHz ASTM D150
Volume Resistivity ≥1.0X1012Ohm-meter ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 8.5W/m-K ASTM D5470

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

8.5W/mK Silicone Thermal Pad for GPU CPU LED -40~200℃ 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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