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1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL & RoHS
Số mô hình: TIF100-12-05ES
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000pcs
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: 24*13*12cm thùng
Thời gian giao hàng: 3-5 ngày làm việc
Điều khoản thanh toán: T/t
Khả năng cung cấp: 1000000 PC/tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: 1,2w/mk khoảng cách nhiệt filler pad đa kích thước silicon pad nhiệt độ cao CPU đồ họa Tản tản nhiệt Ứng dụng: CPU Đồ họa Tản biến nhiệt
Độ dày: 0,020"(0,5mm)~0,200"(5,0mm) Trọng lượng riêng: 2.0g/cc
Điện áp phân hủy điện môi: ≥5500 VAC Độ dẫn nhiệt: 1,2w/mk
Từ khóa: tấm đệm khe hở nhiệt Vật mẫu: Mẫu miễn phí

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Products description


The TIF®100-12-05ES Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive. They are applied to fil the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. Its smooth, puncture-, tear-, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

 

Features


> Good thermal conductive: 1.2W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts


Applications


> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

> Mass storage devices
> Automotive electronics
> Set top boxes

 

Typical Properties of TIF®100-12-05ES Series
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Specific Gravity 2.0g/cc ASTM D297
Hardness 12±5 Shore 00 ASTM 2240
Operating Temp -40 ~ 160℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant @1MHz 4.5MHz ASTM D150
Volume Resistivity ≥1.0X1012 Ohm-cm ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 1.2 W/m-K ASTM D5470

 

Product Thicknesses:

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)


Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

1.2W/Mk Thermal Gap Filler Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad 0

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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