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Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors

Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL & RoHS
Số mô hình: TIF600G
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000 chiếc
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: Thùng 24 * 23 * 12cm
Thời gian giao hàng: 3-5 ngày làm việc
Điều khoản thanh toán: T/T
Khả năng cung cấp: 1000000 PC/tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: Hiệu suất cách nhiệt tốt Tấm tản nhiệt dẫn nhiệt 6W/MK cho bộ xử lý AI Sự thi công: Chất đàn hồi silicon đầy gốm
Phạm vi độ dày: 0,5-5,0mmT Màu sắc: Ngọc Hồng lựu
Hằng số dielectric @ 1MHz: 4.5 Điện áp đánh thủng(V/mm)): ≥5500
Xếp hạng lửa: UL94 V-0 Độ dẫn nhiệt: 6.0W/m-K
Ứng dụng: Bộ xử lý AI Từ khóa: Tấm nhiệt
Làm nổi bật:

6W/MK thermal pad for AI processors

,

silicone thermal pad with insulation

,

high conductivity thermal pad AI

Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors​

 

 Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®600G Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.

 

Features:
 

> Good thermal conductivity: 6.0W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability


Applications

 

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Heat pipe thermal solutions

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module

 

Typical Properties of TIF®600G Series
Property Value Test method
Color Garnet Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.5~0.75)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness (Shore OO) 60 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.020"(0.50 mm)-0.200" (5.00 mm) with increments of 0.01 0inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010” to 0.020” (0.25mm to 0.50mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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