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Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL & RoHS
Số mô hình: TIF700PU
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000 chiếc
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: Thùng 24 * 23 * 12cm
Thời gian giao hàng: 3-5 ngày làm việc
Điều khoản thanh toán: T/T
Khả năng cung cấp: 1000000 PC/tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: CPU nhiều độ dày Độ dẫn nhiệt cao Tấm tản nhiệt silicon cắt khuôn cho bộ xử lý AI Máy chủ AI Độ dẫn nhiệt: 7,5W/m-K
Ứng dụng: Máy chủ AI Bộ xử lý AI Phạm vi độ dày: 0,5-5,0mmT
Từ khóa: Silicone Thermal Pad Hằng số dielectric @ 1MHz: 4.5
Màu sắc: Xám Điện áp đánh thủng(V/mm)): ≥5500
Xếp hạng lửa: UL94 V-0 Sự thi công: Chất đàn hồi silicon đầy gốm

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

 

 Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®700PU Series an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.

 

Features

> Excellent thermal conductivity:7.5 W/mK
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

 

Typical Properties of TIF®700PU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.5)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness (Shore OO) 70 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 7.5 W/m-K ASTM D5470
7.5 W/m-K ISO22007

 

Product Specifications

Standard Thickness:0.02" (0.50 mm)~0.20" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (203 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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