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Nhà Sản phẩmđệm nhiệt silicon

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL
Số mô hình: TIF100-20-02U
Tài liệu: TIF100-20-02U_Data Sheet.pdf
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000 chiếc
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: Thùng 24*13*12cm
Thời gian giao hàng: 3-8 ngày làm việc
Điều khoản thanh toán: T/T
Khả năng cung cấp: 100000 chiếc / tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: Tấm tản nhiệt silicon có độ dẫn nhiệt cao 2.0W/mK để tản nhiệt trong bộ xử lý AI và ứng dụng máy chủ độ cứng: 65/27 Bờ 00
Từ khóa: Tấm nhiệt silicon Màu sắc: Màu xám trắng
Độ dẫn nhiệt: 2.0W/mk Ứng dụng: Để tản nhiệt trong bộ xử lý AI và ứng dụng máy chủ
Sự thi công: Chất đàn hồi silicon chứa đầy gốm độ dày: 0,010 ~ 0,200"(0,25 ~ 5,0mm)
Vật mẫu: Miễn phí

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications
Product Overview

TIF®100-20-02U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.

Key Features
  • Good thermal conductivity
  • Ultra-soft and highly conformable
  • Self-adhesive without the need for additional surface adhesive
  • Good insulation performance
Applications
  • Home appliance industry
  • Power module
  • Wearable devices
  • Solar photovoltaic panels
  • LED lighting fixtures
  • Routers
  • Medical devices
  • Audio electronic products
  • Unmanned aerial vehicles (UAV)
  • Photovoltaic systems
  • Signal communication
  • New energy vehicles
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-20-02U Series
Property Value Test Method
Color Gray white Visual
Construction Ceramic filled silicone elastomer ******
Density (g/cm³) 2.7 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 (0.25~0.50)
0.030~0.200 (0.75~5.00)
ASTM D374
Hardness (Shore 00) 65 | 27 ASTM 2240
Continuous Use Temp -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications 0


Company Advantages
  • Our value message is "Do it right the First time, total quality control"
  • Our core competency is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and Business Secret Contract
  • Free sample offer
  • Quality assurance contract
Frequently Asked Questions
Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Our customization options include dimensions, shape, color, and coating on one or both sides with adhesive or fiberglass. To place a custom order, please provide a drawing or detailed specifications.
Q: How do I request customized samples?
A: To request samples, you can leave us a message on our website, or contact us via email or phone.
Q: What's the thermal conductivity test method given on the data sheet?
A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 methods are utilized to test thermal conductivity.

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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