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Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL
Số mô hình: TIF100L 3030-06
Tài liệu: TIF100L 3030-06_Data Sheet ...t .pdf
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000 chiếc
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: Thùng 24 * 13 * 12cm
Thời gian giao hàng: 3-8 ngày làm việc
Điều khoản thanh toán: T/T
Khả năng cung cấp: 100000 chiếc / tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: Chất độn khe hở nhiệt với chất độn silicon và gốm có độ biến động thấp để tối ưu hóa việc truyền nhi Sự thi công: Chất đàn hồi silicon chứa đầy gốm
độ cứng: 65/30 Bờ 00 Màu sắc: Trắng
Ứng dụng: Để tối ưu hóa việc truyền nhiệt giữa các linh kiện điện tử và tản nhiệt dẫn nhiệt: 3.0 W/mK
độ dày: 0,010 "(0,25mm) ~ 0,200" (5,0mm) Tỉ trọng: 30,0 g/cm3
Từ khóa: Chất độn khoảng cách nhiệt

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink


Company Profile


Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Products description

The TIF®100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fill the micro gaps between the heating interface and the heat dissipation structure, significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.


Features

> Ultra low volatility of siloxane
> Good thermal conductivity
> Excellent weather resistance and aging resistance
> Highly compressible, easy to install and operate
> Good insulation performance

Applications

> Motor Controller (MCU)
> Airborne computer
> Machine vision camera
> High performance ASIC chip
> Central control screen


Typical Properties of TIF®100L 3030-06 Series
Property Value Test method
Color White Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness ( Shore 00) 65 30 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 3.0 ASTM D5470
3.0 ISO22007


Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)


The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink

Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


FAQ


Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.


Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.


Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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