Pad lấp lỗ nhiệt TIF300 Xám

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January 30, 2021
Kết nối danh mục: đệm nhiệt silicon
Tóm lại: Tham gia cùng chúng tôi để xem cận cảnh miếng đệm lấp đầy khe hở nhiệt TIF300 Grey và xem cách nó tăng cường khả năng quản lý nhiệt trong ngành điện tử ô tô. Video này giới thiệu các tính năng, ứng dụng và lợi ích của nó cho các chuyên gia B2B.
Đặc điểm sản phẩm liên quan:
  • Features good thermal conductivity of 1.5 W/mK for efficient heat transfer.
  • Naturally tacky surface requires no additional adhesive coating for easy application.
  • Soft and compressible design ensures low stress on sensitive electronic components.
  • Available in various thicknesses from 0.5mm to 5.0mm to fit different gap requirements.
  • Electrically isolating properties provide safety for automotive electronics applications.
  • Suitable for continuous use across a wide temperature range from -40°C to 160°C.
  • UL 94-V0 fire rating ensures high safety standards for automotive applications.
  • Available with optional pressure-sensitive adhesive on one or both sides as needed.
Câu hỏi thường gặp:
  • What is the thermal conductivity of the TIF300 Grey thermal gap pad?
    The TIF300 Grey thermal gap pad offers good thermal conductivity of 1.5 W/mK, providing efficient heat transfer for automotive electronics applications.
  • Does this thermal pad require additional adhesive for installation?
    No, the TIF300 Grey thermal gap pad features a naturally tacky surface that requires no additional adhesive coating, making installation straightforward and efficient.
  • What thickness options are available for this thermal gap filler?
    The TIF300 Grey thermal gap pad is available in various thicknesses ranging from 0.020-inch (0.5mm) to 0.200-inch (5.0mm), allowing for precise fitting in different automotive electronic applications.
  • What temperature range can this thermal gap pad withstand?
    This thermal gap pad is designed for continuous use across a wide temperature range from -40°C to 160°C, making it suitable for demanding automotive environments.