Name: Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: Dòng TIF100-15-11F
Price: 4.10 USD
Availability: InStock

Nhà Sản phẩm đệm nhiệt silicon

Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

Thông tin chi tiết sản phẩm:

Nguồn gốc:	Trung Quốc
Hàng hiệu:	Ziitek
Chứng nhận:	UL & RoHS
Số mô hình:	Dòng TIF100-15-11F
Tài liệu:	TIF100-15-11F_Data Sheet.pdf

Thanh toán:

Số lượng đặt hàng tối thiểu:	1000 chiếc
Giá bán:	0.1-10 USD/PCS
chi tiết đóng gói:	Thùng 241312cm
Thời gian giao hàng:	3-5 ngày làm việc
Điều khoản thanh toán:	T/T
Khả năng cung cấp:	1000000 PC/tháng

Tiếp xúc

Chi tiết sản phẩm

Tên sản phẩm:	Chất làm đầy khe hở nhiệt được thiết kế để lấp đầy những khoảng trống không khí và tăng cường truyền	Phạm vi suy nghĩ:	0,010 "(0,25mm) ~ 0,200" (5,0mm)
Chứng nhận:	RoHS and UL recognized	Vật mẫu:	Mẫu có sẵn
Đánh giá Flam:	94 V0	độ cứng:	65/60 Bờ 00
Độ dẫn nhiệt:	1,5W/mk	Màu sắc:	Màu xám đậm
Từ khóa:	Chất độn khoảng cách nhiệt

Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

TIF^®100-15-11F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a balance between heat dissipation, insulation, and mechanical stability.

Key Features

Excellent thermal conductivity: 1.5 W/mK
Soft and compressible for low stress applications
Naturally tacky needing no further adhesive coating
Available in various thicknesses
Broad range of hardnesses available

Applications

Cooling components to chassis or frame

High speed mass storage drives

LED TV and LED-lit lamps

RDRAM memory modules

Micro heat pipe thermal solutions

Display cards and motherboards

Notebook computers and power supplies

Telecommunication hardware

Memory modules

Home appliance industry

Power module

Wearable devices

Technical Specifications of TIF^®100-15-11F Series

Property	Value	Test Method
Color	Dark Gray	Visual
Construction	Ceramic filled silicone elastomer	-
Density (g/cm³)	2.2	ASTM D792
Thickness Range	0.010"~0.020" \| 0.030"~0.200" 0.25~0.50mm \| 0.75~5.00mm	ASTM D374
Hardness (Shore 00)	65 \| 60	ASTM 2240
Operating Temperature	-40 to 200℃	-
Breakdown Voltage (V/mm)	≥5500	ASTM D149
Dielectric Constant @ 1MHz	4.5	ASTM D150
Volume Resistivity	＞1.0*10¹² Ohm-meter	ASTM D257
Flame Rating	V-0	UL 94 (E331100)
Thermal Conductivity	1.5 W/m-K	ASTM D5470 / ISO22007

Product Dimensions

Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with 0.010" (0.25 mm) increments

Standard Size: 16" * 16" (406 mm * 406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging & Lead Time

Packaging: Protected with PET film or foam, paper card separation between layers, export carton packaging, customizable to customer requirements.

Lead Time: For quantities of 5000 pieces, delivery time is negotiable.

Frequently Asked Questions

Are you a trading company or manufacturer?
We are a manufacturer based in China.

Do you accept custom orders?
Yes, we welcome custom orders. We can customize dimensions, shapes, colors, and apply adhesive coatings or fiberglass reinforcement as required. Please provide drawings or detailed specifications.

How much do the pads cost?
Pricing depends on size, thickness, quantity, and specific requirements such as adhesive applications. Please provide these details for an exact quote.

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