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5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation

5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation

Thông tin chi tiết sản phẩm:
Nguồn gốc: Trung Quốc
Hàng hiệu: Ziitek
Chứng nhận: UL & RoHS
Số mô hình: TIF100-50-50S
Tài liệu: TIF100-50-50S_Data Sheet.pdf
Thanh toán:
Số lượng đặt hàng tối thiểu: 1000 chiếc
Giá bán: 0.1-10 USD/PCS
chi tiết đóng gói: Thùng 24*13*12cm
Thời gian giao hàng: 3-5 ngày làm việc
Điều khoản thanh toán: T/T
Khả năng cung cấp: 1000000 PC/tháng
Tiếp xúc
Chi tiết sản phẩm
Tên sản phẩm: Chất làm đầy khe hở nhiệt 5.0W/mK Thích hợp cho bộ xử lý AI và thiết bị điện tử yêu cầu truyền nhiệt Từ khóa: Chất độn khoảng cách nhiệt
Vật mẫu: Mẫu miễn phí Xếp hạng lửa: 94 V0
Màu sắc: HỒNG Độ dẫn nhiệt: 5.0W/m-K
Hằng số điện môi @ 1 MHz: 7,5 Điện áp đánh thủng(V/mm)): ≥5500
Phạm vi độ dày: 0,010"~0,200"(0,25mm~5,0mm) Ứng dụng: Dành cho bộ xử lý AI và thiết bị điện tử yêu cầu truyền nhiệt và cách nhiệt

5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation
TIF®100-50-50S Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
Key Features
  • Good thermal conductivity: 5.0W/mK
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • High tack surface reduces contact resistance
  • RoHS compliant
  • UL recognized
Applications
  • Computer / communication equipment
  • Laptop / tablet / PC server
  • New energy power battery / vehicle equipment
  • Switching power supply / UPS
  • Video / security equipment
  • Any heating element and radiator
  • Home appliance industry
  • Power module
  • Wearable device
  • Solar photovoltaic panel
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-50-50S Series
Property Value Test Method
Color Pink Visual
Construction & Composition Ceramic filled silicone elastomer -
Density (g/cm³) 3.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Continuous Use Temp -40 to 200℃ -
Breakdown Voltage (V/mm) ≥ 5500 ASTM D149
Dielectric Constant@1MHz 7.5 ASTM D150
Volume Resistivity(Ohm-meter) >1.0×10¹²  ASTM D257
Thermal Conductivity (W/m-K) 5.0 ASTM D5470 / ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation 0

Packaging & Lead Time
Packaging Details:
• PET film or foam for protection
• Paper card to separate each layer
• Export carton inside and outside
• Customized to meet customer requirements
Lead Time: Quantity: 5000 pieces - To be negotiated
Frequently Asked Questions
  • Q: Are you a trading company or manufacturer?
    A: We are manufacturer in China.
  • Q: What thermal conductivity test method was used?
    A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
  • Q: Is GAP PAD offered with an adhesive?
    A: Most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
  • Q: How do I place an order?
    A: Click the "Send messages" button, fill out the form with your questions and purchase requests, and we will reply as soon as possible via email or online.
About Ziitek
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective thermal management solutions. Our facilities include advanced production equipment, full test equipment, and fully automatic coating production lines supporting production of high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products are UL94 V-0, SGS and ROHS compliant.

Chi tiết liên lạc
Dongguan Ziitek Electronical Material and Technology Ltd.

Người liên hệ: Dana Dai

Tel: +86 18153789196

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